IC Design Contract R&D Services

Our silicon design service encases a wide range of capabilities, from Front End design in Analog Circuit, Digital Logic, DFx, Device Functional Verifications etc to Back End Design in custom layout, structural design/auto place & route, timing analysis, physical verification as well as full chip integration. We have competent resources in various semiconductor manufacturing nodes including World Top Notch 10nm & below finFET technology in order to provide high value to our international MNC clients.
 
Industry Experiences & Segments
  • Smartphone SoC & Chipsets
  • Computing SoC & Chipsets
  • Graphic Chips (GPU)
  • FPGAs
  • A.I. Chips
  • Automotive Electronics (MCU, ECU, Sensors, Power Regulator)
Process Nodes Design Knowhow
  • Bipolar CMOS DMOS (150nm/130nm/90nm)
  • 55nm, 40nm, 28nm, 20nm
  • 16nm finFET
  • 14nm finFET
  • 10nm finFET
  • 7nm finFET
 

 

Front End Design Functions
  • Analog Circuit Design
  • Digital Logic Design
  • Device Functional Verification  (DV / PSV)
  • DFx
  • Micro Architect
Back End Design Functions
  • Analog Custom Layout
  • Structural Design / Auto Place & Route
  • Physical Verification
  • Full Chip Integration
  • Timing Analysis

 

If you are interested in engaging a company for any projects related to IC Packaging, look no further. Our IC Package Design encompasses the whole IC substrate  design process, from the very beginning to the end. Our experiences in IC Design include CPU, SoC, Chipsets (including desktops, laptops, tablets and smartphones), network storage, gateway design, test vehicles as well as fibre optics. On the other hand, our Packaging Technology design knowhow includes different aspects such as Package on Package (PoP), System in Package SiP), Interposer Design, Standard and Custom (balls anywhere) FC-BGA, WB-BGA, vfBGA & others such as PGA, FC-CSP & FC-LGA.
  • PoP Package on Package
  • SiP System in Package
  • FC-BGA, WB-BGA, vfBGA
  • PGA, FC-LGA, FC-CSP
  • Interposer